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| LEADER |
00899nam#a2200217#a#4500 |
| 001 |
BCCAB015947 |
| 008 |
100205s2009####enk####f######100#0#eng#d |
| 005 |
20100728151242.0 |
| 003 |
AR-BCCAB |
| 245 |
1 |
0 |
|a Thermal design and thermophysical properties for electronics :
|b Tsukuba, Japan, from June 18 to 20, 2008.
|
| 260 |
# |
# |
|b The Japan Society of Applied Physics,
|c 2009.
|
| 300 |
# |
# |
|a p.
|
| 490 |
1 |
# |
|a Japanese Journal of Applied Physics ;
|v v. 48, no. 5,
|x 0021-4922
|
| 111 |
2 |
# |
|a International Symposium on Thermal Design and Thermophysical Property for Electronics (E-Them 2008
|n (1st :
|d 2008 :
|c Tsukuba, Japan)
|
| 700 |
1 |
# |
|a Baba, Tetsuya.
|4 edt
|
| 080 |
# |
# |
|a 538.95
|
| 650 |
# |
7 |
|a Thermodynamic properties.
|2 inist
|
| 650 |
# |
7 |
|a Propiedades termodinámicas.
|2 inist
|
| 040 |
# |
# |
|a arbccab
|b spa
|
| 942 |
# |
# |
|c BK
|
| 952 |
# |
# |
|2 udc
|7 NOT_LOAN
|a ARBCCAB
|b ARBCCAB
|i 015947_nuevo-0
|o JPN. J. APPL. PHYS.
|p 015947_nuevo-0
|t 1
|y BK
|
